USB 3.1 with Variable Mount Dual Row 2mm – USB 3.1 with Variable Mount
Application & Features
USB-IF Association
USB 3.1 SuperSpeed Gen 2 has a bandwidth of 10Gbps
Data/Communications
Industry Standard
PCB Motherboard
Notebook and Mobile Computing Applications
Specifications
Flame Rating: UL 94V-0
Current Rating: 1.8 Amp to Vbus; 0.25 Amp to all other contacts/5 Amps
Contact Resistance: 30 Mohms for Vbus and GND pin; 50Mohms for all contacts
Insulator Resistance: 100 Megohms min @ 100 DAC
Voltage Rating: 5V AC
Dielectric Withstanding: AC 100V
Operating Temperature: -25° ~ +105° C
Mating Cycles: 5000
Contact Material: Copper Alloy
Shell : Steel
Contact Underplate: 60u”~100u” Nickel
Solder Tail Plating: 100u”~200u”Tin (Lead Free)
Contact Area: 1u” Gold
Insulator Material: Thermoplastic
Options
Green Options: RoHS2 Directive 2011/65/EU
Type: A Type USB
Contact Plating: Gold Flash – 30u
Packaging: Tape & Reel (T&R)
Packaging: Tray
Gender: Female
Color: Blue (Pantone 300C)
Shell Plating: 80u” Nickel
Shell Plating: Nickel(Steel)
Solder Tails: 100u”-200u” Tin
Mount Type: Offset 1.75mm or Center 4.15mm
Type : Dual/Single
Options: See PDF/CAD for all details
Technical Sheets
Download Center Hieght PDF Download Off-Set PDF
Download Center Hieght CAD Download Off-Set CAD
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